Job Description

Collaborate with a multi-disciplinary team of engineers to assess new architectures, devices, technologies, and materials, shaping the future of NAND technology for the next 5+ years. Innovative Leadership: Lead the integration of cutting-edge 3D NAND technology and develop a strategic technology roadmap. Problem Solving: Identify and evaluate critical technology gaps, mobilizing cross-functional teams to address these challenges. Module Development: Define construction specifications based on electrical and inline metrics, unit processes, and design rules. Invent innovative solutions to meet product requirements. Experimental Design: Design, execute, and analyze experiments to meet engineering specifications, leveraging structure-to-electrical correlations. Technical Innovation: Solve complex problems using a model-based approach and promote technical innovation through process improvements, patent generation, and authoring technical papers. Critical Thinking: Ability to think critically, draw logical conclusions, and apply deep understanding to problem-solving. Strategic Direction: Experience in providing strategic direction in complex situations and generating creative solutions. Clear Communication: Ability to articulate thoughts and provide clear direction in ambiguous situations. Continuous Learning: Strong desire to advance knowledge and skills. Goal-oriented with a focus on efficiency, strong work ethics, and motivation. Growth mindset: Ability to accept constructive criticism and derive positive solutions from diverse ideas/proposals. Data Proficiency: Proficiency in data analysis, machine learning, and statistical modeling to derive actionable insights from complex datasets is an added advantage. Technical Expertise: Experience in NAND process integration, device, or design is a plus. MS or PhD (preferred) in Electrical Engineering, Materials Science, Chemical Engineering, or a related field