Job Description

Seeking a development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ULP CMOS platforms. The role spans from early-stage process development through to manufacturing transfer.
Key Responsibilities
Develop and optimize process flows and recipes for defect-free, high-reliability manufacturing
Lead integration of new advanced packaging features on FINFET and FDSOI platforms
Coordinate device testing and ensure robust inspection & control methodologies
Analyze performance, reliability, and defect data to drive improvements
Freeze qualified processes and support production ramp-up
Cross-functional collaboration and occasional reporting to internal/external stakeholders
Ensure compliance with EHS&S requirements
Ideal Requirements
B.S. in EE, Materials Science, or related field (M.S./Ph.D. preferred)
8-12+ years' experience in advanced packaging, integration, R&D, NPI, or module development
Strong in DOE, lot handling, data analysis (inline/HOL/ET)
If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
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Advanced Packaging Integration Expert - D2W / CMOS
Singapore Posted about 18 hours ago
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