Job Description

Key Job Responsibilities:

Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes Operate and optimize 2D/3D AOI systems and inspection parameters Configure AOI inspection algorithms for new product designs Set up process conditions and equipment configurations for new packages and production lines Optimize reflow parameters and temperature profiles Analyze solder/micro bump quality and implement improvements Conduct root cause analysis and implement corrective actions for process issues Support customer quality requirements through technical evaluation and documentation

Qualifications:

Bachelor's degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics) Minimum 3 years of experience in AOI or reflow process in semiconductor backend Ability to establish process conditions and optimize parameters Strong data analysis and problem-solving skills Proficient in writing technical documents and communicating in English Knowledge of inspection or reflow/soldering principles Experience in defect analysis and developing defect evaluation criteria Required experience with bump and RDL inspection Basic understanding of thermal, electrical, and material behavior in reflow processes Experience in advanced packaging process such as 2.5D, fan-out and flip-chip Familiarity with quality tools such as APQP, FMEA and 8D methodology Experience in responding to customer quality requirements or certification audits Ability to write technical documentation and communicate in English Hand-on experience with major AOI equipment(e.g., KLA, onto, Camtek) Collaborative experience in AOI image analysis and algorithm development Experience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids. Experience in quality and reliability evaluation related to reflow or soldering processes * Understanding of associated assembly/joining processes (eg. Bonding, chip attach)