Application Engineer (die Sorter / Die Bonding)
Singapore, Singapore
Job Description
Roles & Responsibilities:
- Define and optimize equipment process parameters for die sorter or die bonder machines to meet performance specifications.
- Collaborate with QA and engineering teams to streamline internal buy-off specs and resolve process-related issues.
- Analyze process data using SPC, DOE, and other statistical tools to drive continuous improvement.
- Support customer applications, provide technical solutions, and train internal teams on equipment performance.
- Degree in Production, Mechanical, or Material Science Engineering or equivalent.
- At least 3 years of experience in an equipment or semiconductor manufacturing environment.
- Strong knowledge in process design, control, and optimization; experience with die-sorting, vision inspection, or laser marking.
- Proficient in SPC, DOE, and other statistical tools; familiarity with cycle time calculation and material science.
If you are keen to apply for the position, kindly email your detailed resume in MS Word to careers@recruit-expert.com
Please note that only shortlisted candidates will be notified.
Ref: 1651299
EA Licence: 19C9701
Registration: R21100996
Skills Required
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Job Detail
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Job IdJD1662221
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:$3,500-5,500 per month
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Employment StatusPermanent
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Job LocationSingapore, Singapore
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EducationNot mentioned