Job Description

Requirements

Degree/Diploma on Mechanical/Electrical/Electronics Engineering or equivalent Min. 3 years of experiences in Semiconductor or Manufacturing Knowledge on equipment assembly and test with reference to assembly drawing and schematics. Trained on equipment troubleshooting and maintenance. Failure analysis and technical report. Good leadership, communication and able to work with customer on technical issues and support evaluations.

Job Responsibilities:

Perform line setup, assembly, test, qualify and maintenance of wire bonder equipment Provide technical support to customer related to assembly and review drawing specification and Bill of materials. Conduct training and certification on technicians and work with relevant departments to achieve quality output and deliveries. Design/fabricate tools, jigs and fixtures and participate on continuous improvement and projects. Participate on MRB meetings to review non-conformance parts disposition and monitor in-process yield/reject and scrap. * To comply on any other duties assigned by supervisor/manager.