Dicing Process Engineer
SG, Singapore
Job Description
The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company's mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates. The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.
Job Requirement
Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field. Minimum 5 years of hands-on experience in wafer dicing process development, preferably in semiconductor or photonics industries. Proven track record of developing and scaling dicing processes for glass and silicon wafers. Deep understanding of wafer materials, mechanical properties, and dicing-induced stress. Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI. Familiarity with Cleanroom practices and wafer handling protocols. Strong Problem-solving and communication skills. * Strong Team spirit, sense of respeonsibility, result-oriented mindset and practical work ethics.
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Job Detail
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Job IdJD1642168
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationSG, Singapore
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EducationNot mentioned