Generate package design and analyze Electrical performance and characterizations
Design inputs of advanced packages to meet electrical specifications & requirements
Develop novel electrically enhanced package technology aligned to company roadmap
Looking into new technology and capability related to electrical, electronics and communication field to build up new capabilities
Experimental measurement using TDR, Universal Tester. Etc. to correlate simulation results and failure analysis
Assess the feasibility of new packaging assembly and process technologies with respect to electrical performance.
Conduct IC packaging technology development together with other teams
Requirements :
Bachelor in Electrical / Electronics Engineering or related
Good knowledge of microwave and transmission line theory
Electrical modeling experience using electromagnetic field / circuit simulation software such as Ansys HFSS / Q3D / SIwave / Cadence or Keysight ADS is a plus
Electrical characterization experience using VNA and TDR is highly desirable
Keen for R&D activities in IC packaging technology development, package's electrical analysis/ design/ optimization/ characterization.
Candidates with no experience can apply as training provided.
Interested candidates can forward their CVs in MS Word format to alex@triton-ai.com
Reg No. R1549345
Triton AI Pte Ltd
License no. 21C0661
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