Job Description

Technology Development: Develop and enable advanced package technology for various post-fab wafer finish and assembly processes Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity Integrate semiconductors while partnering with process and product engineering teams Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements Ensure defense coverage through process, measurement, inspection, and testing Establish correlations between defense mechanisms to identify improvement opportunities Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control Ensure smooth transition from new product development, qualification, small volume production to high volume production Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities Bachelor's or advanced degree in Engineering or Science is required Strong analytical, logical, and critical thinking skills Effective communicator, able to collaborate across all levels Growth mindset with a passion for continuous learning Internship or experience in the semiconductor industry is a plus Demonstrated leadership and a track record of impact are highly desirable Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics is preferred. Experience with Visual Basic for automation and tool integration is preferred.

Skills Required