Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting.
Monitor and improve device yield performance and process SPC charts
Investigate, analyze and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots
Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc.
Perform evaluation of new materials and continuous improvement program (CIP) to support yield and cost improvement.
Generate training materials and facilitate training of manufacturing personnel on operating procedure and process specification.
Work closely with inter-department to improve process and equipment performance and capability.
Coordinate and communicate with customers for any process engineering related matters.
Requirements:
Diploma / Degree in any Engineering Discipline
Minimum 2 years experience in semiconductor assembly manufacturing Engineering, AOI/vision system, post-test, TNR process is an advantage.
Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
Experience in customer and supplier engagement
Know-how in process definition, qualification, optimization, equipment operation and buyoff.
Ability to work on ad-hoc projects in process and equipment
Multi-tasking for both equipment and process engineering activity.
Additional Information
Career Level
Junior Executive
Qualification
Diploma, Advanced/Higher/Graduate Diploma, Bachelor\'s Degree, Post Graduate Diploma, Professional Degree
Years of Experience
2 years
Job Type
Full-Time
Job Specializations
,
Company Overview
The ASE Group is the world\'s largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry\'s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co., Ltd. and its subsidiaries, members of the ASE Group.
Come and join us in this exciting growth!
Additional Company Information
Registration No.
199800834K
Company Size
501 - 1000 Employees
Average Processing Time
24 days
Industry
Semiconductor/Wafer Fabrication
Benefits & Others
Smart Casual, Mondays-Fridays / Shift required, depending on positions