As a Failure Analysis (FA) Trainee, you will have the opportunity to contribute to the advancement of semiconductor technologies by supporting the critical process facts and issues in line for our research institute. As part of the Failure Analysis team, you will play a key role in identifying, understanding, and resolving process issues in cutting-edge semiconductor device process, packaging and materials.
Through this role, you will gain hands-on experience in advanced analytical techniques such as electron microscopy, spectroscopy, and electric tester. You will also develop key competencies in root cause analysis, material characterization for advice packaging, and cross-functional collaboration with design, process, and packaging teams.
This traineeship will equip you with a strong foundation in advance package for semiconductor devices, failure mechanisms, and the investigative mindset required to drive innovation and ensure product robustness in high-performance applications.
What will you be working on
Job Responsibilities
Investigate samples from projects and customers.
Perform root cause analysis and data analysis.
Work with project members to optimize the procedures and documentation.
Support continuous improvement and reliability enhancement efforts.
Interface with customers and internal stakeholders to communicate findings.
What we are looking for
Job Requirements
Bachelors'or Masters'degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related fields.
Knowledge of semiconductor manufacturing processes, including wafer fab, assembly, and test operations.
Experience with FA process flows, Material phase diagram, and SEM
Key Competencies Required
Root Cause Analysis
Data Analysis
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