Intern Aptd Sg Wafer Level Technology

SG, Singapore

Job Description

Our vision is to transform how the world uses information to enrich life for all.




Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Summary


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Support development of High Bandwidth Memory (HBM) technology through metal plating characterization. The intern will design and execute experiments, collect and analyze data, and recommend process targets for different metal stacking combinations and aspect ratios. Collaboration with the chemical lab will be required to establish specific metal concentration analysis.

Department


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APTD Singapore Post Wafer Fabrication

Project Title


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Metal Plating Characterization for Advanced High Bandwidth Memory Technology Development

Project Description


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Design and follow up on experiments for incumbent and alternative metal plating chemistry characterization. Multi-Metal Stack Evaluation: Plate wafers with different stack sequences or other combinations and analyze interface quality, Inter-Metallic Compound(IMC) thickness. Metal Concentration Impact: Study how variations in metal ion concentration influence plating uniformity and stack integrity (e.g %Ag or other metals). Collaborate with the chemical lab for accurate concentration analysis. Collect and analyze experimental data to identify trends and recommend process targets.

Scope


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Explore plating process parameters and metal stack variations impacts on performance. Develop data-driven recommendations for process optimization.

Deliverable


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Comprehensive analysis report with recommended process targets and validated experimental results. Target to achieve plating coplanarity <1um.

Impact of Project


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Enable robust metal plating processes for next-generation HBM technology.

Skillset Required


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Critical thinking Data analysis Strong problem-solving skills

Course of Interests


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Material Science and Engineering, Chemical Engineering or related courses

Duration Period


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Minimum 4 months

About Micron Technology, Inc.




We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities -- from the data center to the intelligent edge and across the client and mobile user experience.



To learn more, please visit micron.com/careers



All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.



To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com


Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.


Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.


AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.


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Job Detail

  • Job Id
    JD1711718
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Internship
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    SG, Singapore
  • Education
    Not mentioned