At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.
When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!
Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation - whilst unlocking your own potential.
YOUR ROLE
You take part in creating the best new hire experience in the project to completely renew our talent acquisition and onboarding process. You also help us with finding the best vendors for recruitment, and managing the a to z collaboration with them.
Attach to Semiconductor (WLCSP) Package development R&D lab
Report and assist to Staff Engineer for WLCSP Construction analysis, FA with report writing Task
Following On job training will be received before hands on attachment
1. Practical hands-on training of relevant Lab equipment, X-sectioning,
2. Semiconductor assembly process training
3 Wafer Level Chip Scale (WLCSP) process training
4. Type of Failure Analysis and flow step training
5. Company orientation and workplace safety training
YOUR SKILLS & EXPERIENCES
Diploma in Electronic Engineering or Electronic & Computer Engineering or similar
Willing to hands-on and team works spirits and possess good communication skills
Some basic Knowledge of Semiconductor (but not compulsory)
Skills of Microsoft office power point, Excel and Words
English business proficiency
Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!
To discover more, visit st.com/careers
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