Are you passionate about pushing the boundaries of lithography technology? We're seeking an innovative Lithography Engineer/ Manager to drive breakthrough solutions in advanced packaging. This is your opportunity to work at the forefront of panel lithography and 2.5D/3D IC integration, where your expertise will directly impact next-generation semiconductor solutions.
What You'll Do
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Lead Innovation in Lithography Development
Own end-to-end lithography process development for cutting-edge advanced packaging solutions
Pioneer panel lithography technologies that will define industry standards
Design and implement manufacturable processes that deliver exceptional yield and repeatability
Drive continuous improvement initiatives focused on cost reduction, cycle time optimization, and yield enhancement
Shape Technology from the Ground Up
Define specifications for next-generation lithography equipment and lead tool validation efforts
Collaborate with equipment vendors and cross-functional teams to bring innovative solutions from concept to production
Integrate AI/ML methodologies to accelerate process discovery and optimization
Solve Complex Technical Challenges
Lead root cause analysis and resolution of lithography defects using advanced characterization techniques
Implement sophisticated process monitoring systems and statistical analysis (DOE, SPC) to maintain tight process control
Work seamlessly with upstream and downstream process teams (plating, deposition, etching) to ensure flawless integration
Drive Quality Excellence
Develop and deploy advanced defect inspection strategies using state-of-the-art tools (optical inspection, SEM, AFM)
Create comprehensive documentation including SOPs, work instructions, and control plans
Support customer qualifications and reliability testing to ensure world-class product quality
Collaborate Across the Organization
Partner with design, product engineering, and manufacturing teams to enable successful new product introductions (NPI)
Participate in strategic product risk management discussions, leveraging your expertise to influence critical decisions
Mentor team members and contribute to a culture of technical excellence
Required Qualifications
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Education:
PhD or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field
Experience:
5-10+ years in lithography development, with demonstrated success in advanced packaging applications
Technical Expertise
Deep knowledge of lithography processes and equipment for advanced packaging (2.5D/3D IC, interposers, panel-level packaging)
Hands-on experience with metrology and characterization tools: CD-SEM, optical film metrics, XRF, 4PP, ellipsometry, profilometry
Proficiency in defect analysis using optical inspection, SEM, and AFM
Strong statistical analysis skills with experience in DOE, SPC, and data-driven decision making
Ability to independently create recipes and run wafers on lithography metrology systems
Professional Skills
Exceptional problem-solving abilities with a track record of resolving complex technical challenges
Outstanding communication skills with the ability to influence and collaborate across functions
Strong documentation skills and attention to detail
Experience applying AI/ML techniques to process optimization is highly valued
If you are a good match for the role above, please reach out to Ritu Chaudhari for a confidential chat today at ritu@access-people.com
UEN: 201304702D | EAs: 14S7084 / R1109143
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