Job Description

Roles & Responsibilities:

• Perform mechanical & thermo-mechanical analysis and characterization of advanced IC packages
• Build up new mechanical & thermo-mechanical capabilities with latest simulation and characterization technologies
• Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
• Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
• Conduct IC packaging technology development together with other teams
• Carry out mechanical and reliability test and correlate with mechanical & thermo-mechanical simulation for validation

Requirements:

• Bachelor in Mechanical Engineering or related
• Solid knowledge on FEM & mechanics of material
• Mechanical modeling experience for IC package's stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
• Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in fan-out WLP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
• Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
• Keen for R&D activities in IC packaging technology development, package's mechanical & thermo-mechanical analysis/design/optimization/characterization
• No experience are required as training provided.

Interested candidates can forward their CVs in MS Word format to alex@triton-ai.com

Reg No. R1549345

Triton AI Pte Ltd

License no. 21C0661