Job Description

Your responsibilities will include, but are not limited to, the following: Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization. Design Experiments: Design and execute device and process experiments to perform process development and process integration. Passionate about semiconductor technology and innovation. Adept at data analysis, problem-solving, and process integration optimization. Excellent communication skills and ability to work in cross-functional teams. Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable. Minimum of 3 years of experience in the semiconductor industry in the Process Areas or Process Integration. Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms. In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable. Exposure to R&D and transfer/manufacturing is desirable. Committed to quality, collaboration, and continuous improvement. Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment. BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field