Package Development Engineer M/f

Toa Payoh, Singapore, Singapore

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New package and process development for WLCSP.
Define Best Known Method (machine setting, process parameters, ...) and deploy to all manufacturers of ST WLCSP packages.
Support operation team in problem solving of highly technical and complex manufacturing issue.
Lead activity for critical New Product Introduction

Profile

Minimum of Bachelor\'s Degree in Engineering
At least 2 years of relevant working experience on WLCSP package
Experience in semiconductor industry tools such as FMEA, 8D, OCAP etc.
Knowledge on DRM/ DRC is a plus
Highly independent and proactive individual.
Ability to extensive networking with a multi-disciplinary and multi-cultural team

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