Job Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. JR29181 Package Development Quality Engineer As a GQ (Global Quality) Package development quality assurance engineer at Micron Technology Inc., you will be responsible for HBM (High Bandwidth Memory) package quality and reliability for R&D of Micron’s advanced package technology using TSV (Through-Silicon Via) channels to create a vertical stacked DRAM (Dynamic Random Access Memory). This responsibility includes coordinating package technology development qualification efforts and fundamental understanding on failure mechanisms for new HBM package technology and when new designs, materials, or processes are introduced; and providing recommendations on quality and reliability risk for future products based on lessons & learnings, technical risk assessment, NUDD (New, Unique, Different, Difficult) analysis, reliability statistical analysis, package quality & reliability test results. You will also be expected to devise reliability test plans or develop new Q&R test methods to assess risk associated with new leading-edge HBM package technology and new customer qualification requirements. You will coordinate root cause and corrective action efforts within the GQ department for HBM package technology qualification failures. Additional duties include leading quality assurance projects when new HBM package technologies are transferred to NPI (New product Introduction) or HVM (High Volume Manufacturing) stages. Responsibilities and Tasks

• Provide holistic qualification plans and lead quality & reliability risk mitigation plan for new HBM package technology research & developments
• Execute proactive technical risk assessment, NUDD (New, Unique, Different, Difficult) analysis for new technology/products and when new designs, materials, or processes are introduced
• Provide recommendations on release of new HBM package technology based on package quality & reliability test results
• Lead proactive risk mitigation (“Shift-left”) & development of early detection methodology for new HBM package technology, customer qualification requirements, industry standards
• Coordinate root cause and corrective action efforts within the GQ (Global Quality) department for HBM package technology qualification failures
• Provide technical support for package-related quality and reliability issues during stage of NPI (New Product Introduction) and HVM (High Volume Manufacturing) in product life cycle

Education required

• Master’s degree or equivalent experience with Bachelor’s degree
• Engineering & Sciences – Materials science, Mechanical, Physics, Chemistry, Electrical & Electronics, related field of study

Experience Required

• 0-2+ years’ experiences in any of the following:
  • Microelectronic packaging, Quality/reliability engineering, Failure analysis

Qualifications

• Knowledge of semiconductor component package assembly processes and challenges
• Knowledge of surface mount processes and challenges
• Understanding of mechanical and material interaction effects on reliability of IC components and/or printed circuit assemblies (PCB) assemblies
• Good understanding of the effects thermomechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability
• A working knowledge of industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferred
• Must be self-motivated, able to work independently, and detail oriented
• Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups
• Good written and verbal communication skills in English and computer skills are necessary
• Ability for other Asian languages, especially Chinese and Japanese, can be a plus
• Working knowledge of the software systems employed in backend manufacturing
• Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.)

About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com . Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.