Packaging Engineer (signal Integrity)

Singapore, Singapore

Job Description

We care deeply about transforming lives with AMD technology to enrich our industry, our communities and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence, while being direct, humble, collaborative and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.

AMD together we advance_

PACKAGING ENGINEER (SIGNAL INTEGRITY)

THE ROLE

The Packaging Signal Integrity engineering team ensures that the performance and cost requirements of the product are met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization.

THE PERSON

The successful candidates must be a team player with a commitment to meeting deadlines/ lead & drive for solutions and an aptitude to thrive & ability work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skill, conflict management skill, with strong interpersonal skills with good executive presentation & communication skills.

KEY RESPONSIBILITIES

  • As a member of the Singapore Signal Integrity team, you will be responsible for the electrical design, simulation and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board.
  • You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD's customers to ensure optimal engineering design decisions and efficient problem solving.
SKILLS and Experience requirements
  • Experience in SI/PI simulation and processing s-parameters
  • Experience in packaging, connector and board design for signal integrity and power integrity
  • Experience in high-speed digital signaling interfaces such as PCIE, GDDR, HDMI and USB
  • Experience in electrical modeling EDA tools such as HFSS, SIwave, ADS
  • Experience in measurement tools VNA, high speed oscilloscope and TDR
  • Experience in test board design, measurement fixtures and de-embedding methodologies
  • Knowledge in analog characterization, electromagnetic theory and digital circuit analysis
  • Knowledge in packaging assembly and IC testing is another plus
  • Ability to collaborate and work across different functional teams and different sites
  • Self-driven and can work independently
ACADEMIC CREDENTIALS
  • Bachelors' degree and beyond
  • ~2 years relevant experience preferred
LOCATION:

Singapore

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers and will consider all applicants without regard to race, marital status, sex, age, color, religion, national origin, veteran status, disability or any other characteristic protected by law. EOE/MFDV

#LI-JV1

Requisition Number: 187143
Country/Region/Location: Singapore State/Province: Singapore City: Singapore

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Job Detail

  • Job Id
    JD1230330
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Singapore, Singapore
  • Education
    Not mentioned