Job Description

Our Client:

Our client is a semiconductor technology design and manufacturing company that specializes in developing integrated optoelectronic solutions for various applications. Their technology enables the integration of multiple functions into a single chip, resulting in cost-effective, compact, and high-performance products. They are seeking to hire a Principal Assembly Engineer to join their team in Singapore.

Your expertise will play a crucial role in conducting tests on assembled devices, generating detailed test reports, and documenting findings for failure analysis. As the Principal Assembly Engineer, you will collaborate closely with internal teams to manage incoming materials for seamless assembly processes.

The Responsibilities:

• Lead and oversee the machine setup, calibration, testing, and mechanical assembly of active devices onto the interposer
• Conduct comprehensive tests on assembled devices, prepare detailed test reports, and provide insightful summaries of the results
• Troubleshoot complex assembly issues and meticulously document findings for thorough failure analysis
• Collaborate with internal teams to ensure efficient management of incoming materials required for assembly operations
• Analyze packaging process specifications, performance, yield, manufacturing cost, and cycle-time. Provide expertise to contribute to essential improvement programs
• Take charge of Wafer Preparation, including process characterization and continuous improvement efforts
• Demonstrate proficiency in operating and maintaining Disco Back Grinding and Stealth Dicer equipment
• Utilize Analytical Software such as JMP, SAS, and TIBCO to gain valuable insights for process enhancements
• Exhibit advanced knowledge of Advance Package interconnection, Flip Chip, Wafer Bumping, Eutectic Bonding, and Solder Ball jetting

The Requirements:

• Bachelor\'s degree or higher in a relevant field
• Extensive and relevant work experience in the Semiconductor Industry
• Proven expertise and hands-on experience with die-assembly tools, flip-chip bonders, wire bonders, and CAD drawing
• Familiarity with semiconductor wafer packaging is highly advantageous
• Exceptional written and verbal communication skills to effectively lead and collaborate with the team

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Disclaimer: The Company complies with the Tripartite Guidelines on Fair Employment Practices (TGFEP), including the prevailing guidelines on recruitment. All qualified applicants will be considered for the position regardless of their age, race, religion, nationality, marital status, or family responsibilities. A more detailed discussion of the TGFEP is available on the Tripartite Alliance for Fair and Progressive Employment Practices (TAFEP) website at https://www.tal.sg/tafep.

Job Reference: JO-230721-322586

RGF Professional Recruitment