Job Description

Location: Singapore
Job ID: HRC0482621

Job description
In your new role you will:

• Technical Lead for Package Technology specific to Package Platform(Power DSO).
• Lead and define definition activities (Design rule, DFMEA, Delta assessment, Cost) for new package projects.
• Coach package design engineers in technical packaging design activities such has generating conceptual drawings, definition of package parameters affecting Assembly processes.
• Act as a technical expert in package reliability know how during definition stage, know how on influences of package design towards customer reliability.
• Key contact partner for package definition to Business Division in Europe especially on Back-End Assembly technologies.
• Actively contribute technical competence to Infineon by publishing technical papers/ journals within Infineon network and contribution towards international community in Asia.

Your profile
You are best equipped for this task if you have:

• PhD / Masters / Bachelor\'s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)
• Minimum 6 years\' experience in Semiconductor Back-End Assembly Development (R&D) experience.
• Experience in Isolated Gate Driver, Current Sensing and Power Package Design is preferred.
• Knowledge in System-in-Package integration and Product System/Application understanding is an added advantage.
• Proficient in Mold flow, Thermo-mechanical, Thermal and Electrical Simulation Interpretation (e.g. Ansys).
• Proficient in AutoCAD and Inventor 3D drafting preferred.
• Able to demonstrate creative thinking in problem solving and generate ideas (IP).
• Good communication and presentation skills.

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant\xc2\xb4s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
for more information about Diversity & Inclusion at Infineon.

Does this sound like just the right challenge for you? If so, we look forward to getting to know you!

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Infineon