Job Description

Location : East Working Days: 5 Days, Monday to Friday Working Hours: 8.30am - 5.30pm Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits Equipment Models : 1 ASM Eagle Extreme Gocu - Wire Bonder 2 Muhibauer CMT 6560/CMT 6530 - Tester 3 Esec 3100 Plus - Wire bonder 4 Esec 2008 SC3 Plus - Die Bonder 5 Muhibauer (CME 3010D +TI 2270) (CME 3060 + T12280) - Encap 6 KNS ConnX ELITE (New machine) - Wire Bond

Location : East
Working Days: 5 Days, Monday to Friday
Working Hours: 8.30am - 5.30pm
Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Equipment Models :

• ASM Eagle Extreme Gocu - Wire Bonder
• Muhibauer CMT 6560/CMT 6530 - Tester
• Esec 3100 Plus - Wire bonder
• Esec 2008 SC3 Plus - Die Bonder
• Muhibauer (CME 3010D +TI 2270) (CME 3060 + T12280) - Encap
• KNS ConnX ELITE (New machine) - Wire Bond

Our Client is a leading technology company providing component-based solutions for security and identification. We are a world-class specialist in the design and manufacture of Micro connectors for smartcards and RFID Antennas and Inlays.

Job Responsibilities:

• Participate in product introduction to deliver new products to market
• Propose new concept of advanced die attach and wire bonding
• Bring an extensive expertise in chip packaging to improve our end users application knowledge
• Lead the setup of die attach and wire bonding recipes in NPI and new product and profile optimization during mass production
• Pilots problem solving projects linked die attach and wire bonding processes, as well as internal and external quality issues
• Understand current standards in substrate and packaging processes and propose optimization of design for manufacturability, focusing in die attach and wire bonding operation
• Work closely with Engineering to optimize packaging supply base for cost, lead time, quality, standardization
• Identify and implement cost saving initiatives related to packaging materials, labour efficiency, integration of process, handling, etc

Requirements:

• Bachelor Degree/Diploma in Mechanical / Electronics/ Electronics Packaging or equivalent
• 3-5 years of experience in IC or smartcard packaging. Strong knowledge and understanding in die attach, wire bond technologies in IC packaging industries
• Competent in the assembly processes of die attach and wire bonding of a smartcard module, knowledge with ASM equipment will be an added advantage
• Ability to troubleshoot failure of die attach and wire bond machines
• ONLY Singaporean welcome to apply

Next Step

• Interested applicants kindly forward the latest copy of your resume in MS Word format, with your last drawn and expected salaries to Jasmine.Toh@adecco.com
• All shortlisted candidates will be contacted.

Jasmine Toh Law Ting

Direct Line: +65 9273 6741
EA License No: 91C2918
Personnel Registration Number: R2092390

Adecco