is responsible for development and establishment of new product and transfer process into production.
Responsibilities
New product development as requested by customer and internal roadmap, and transfer into production
New material, process & machine development and qualification, and transfer into production
Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
Establish, review and update specifications, workflow, quality and safety related documentation for new products and transfer to production line.
Coordinate and liaise with vendor/suppliers on process issue or quality issue.
Support customer NPI activities and internal engineering activities.
Handle and manage customer audits and 8D reports.
Any other ad-hoc duties as assigned.
Requirements
Minimum bachelor's degree in materials science, microelectronics, electrical, chemical engineering or similar disciplines
Experience in semiconductor manufacturing industry and working in cleanroom environment
Minimum 3 years hands-on experience in product development or NPI work in area of Wafer-level Fanout packaging production line or LCD/FPD production line, focusing on
Pick and Place/Die Attach
process.
Knowledge in process engineering, process control engineering and yield enhancement
* Experience in DOE, FMEA, and 8D reports
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