Required Experience : - Processed basic technical knowledge in machine repair and troubleshooting. - Minimum 2 year experience in mass production / engineering environment - Preferably with 2 year hand on experience in repair and troubleshooting of the following machines : Esec Die Attach/wire bonder ASM Die Attach/wire bonder DISCO Wafer Saw Qualification - Diploma / Nitec/ ITE in mechanical / Electrical / Electronic Engineering
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