Semicon Equipment Engineer (wafer Saw & Laser Groove)

Singapore, Singapore
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Job Description


:

  • Responsible for maintenance and repair on any of the following equipment such as DISCO Wafer SAW (DFD 6360 and DFD6361) and DISCO laser groove.
  • Manage a team of associate engineers.
  • Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.
  • Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.
Communicates with Manufacturing, Process, QA, Central Engineering (NPI) to solve issues involving other groupAll Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.Please email your resume in a detailed MS Word format to stating1) Current Drawn2) Expecting Salary3) Date Available4) Reason to Leave each job:We regret that only shortlisted candidates will be notifiedJoyce Koh Ai LengPeople Profilers Pte Ltd20 Cecil St, #08-09, PLUS Building, Singapore 049705Tel: 6950 9737EA License Number: 02C4944EA Personnel Reg nos R1110618Job Id :

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Job Detail

  • Job Id
    JD1459731
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Singapore, Singapore
  • Education
    Not mentioned
 
 
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