Job Description

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Purpose of the Job:

• To support R&D activities for 2.5D wafer-level packaging (WLP) processesincluding Die Preparation, Chip Attach, and Moldfocusing on process reliability, manufacturability, and integration for advanced semiconductor packages.

Key Job Accountabilities:

• Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation: grinding, laser grooving, dicing saw Chip Attach: TCB (Thermo-Compression Bonding), LCB (Laser Compression Bonding) Mold: compression or transfer mold for warpage and protection
• Perform material evaluation and reliability analysis (e.g., XRF, shear test)
• Conduct DOE/FMEA for robust process design and improvement
• Work closely with cross-functional teams (e.g., Bumping, RDL, Failure Analysis) to enable seamless process integration
• Track and analyze industry trends in equipment, materials, and technologies
• Support new product introduction (NPI) and yield ramp-up through structured problem-solving
• Document process flows, risk assessments, and engineering reports

Scope of the Job:

• Directly impacts production readiness, yield, and reliability of high-value 2.5D packages
• Supports NPI for advanced semiconductor customers (e.g., AI, HPC, and memory applications)
• Influences supplier qualification and capital decisions related to 2.5D tooling and materials
• Contributes to revenue generation through early ramp-up and stable process delivery

Requirement:

• Bachelors degree or higher in Engineering (Materials, Electronics, Chemical, Mechanical, or related field)
• 3+ years of hands-on experience in semiconductor packaging process development (Die Prep, Chip Attach, or Mold)
• Proficient in DOE, FMEA, statistical process control, and failure analysis
• Familiar with process and reliability evaluation tools (e.g., XRF, shear test, SAM)
• Skilled in documentation and cross-functional communication
• Experience in OSAT, Fab, or advanced packaging (e.g., 2.5D/3D, HBM, interposer) (Preferred)

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to stating
1) Current Drawn
2) Expecting Salary
3) Date Available
4) Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: 6950 9737
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID:
People Profilers Pte Ltd (People Profilers) has entered into a Partnership Recruitment Collaboration with Employment and Employability Institute Pte Ltd (e2i), to extend the support of hiring beyond e2is resources to broaden the reach of jobseekers.
This is in partnership with the Employment and Employability Institute Pte Ltd (e2i).
e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives. By applying for this role, you consent to People Profilerss PDPA and ( ).

Skills Required