Job Description

Develop and optimize high-precision mechanical modules for advanced semiconductor packaging, ensuring performance, reliability, and seamless integration with cross-functional teams.
Key Responsibilities
Translate customer requirements into detailed mechanical design specifications.
Perform force, thermal, vibration simulations, and module lifetime analysis.
Select materials and design solutions balancing durability, cost, and manufacturability.
Design precision tooling and fixtures for semiconductor packaging processes.
Develop 3D models and conduct structural analysis.
Collaborate with manufacturing and process teams for design-for-manufacturability (DFM).
Support continuous improvement to enhance performance, efficiency, and reliability.
Ensure compliance with safety, quality, and environmental standards.
Ideal Requirements
Degree or higher in Mechanical Engineering or related field.
Experience in mechanical design, preferably in semiconductor or high-precision equipment.
Proficient in Solid Edge, SolidWorks, Pro-E, AutoCAD.
Knowledge of advanced packaging technologies (wafer-level packaging, 2.5D/3D integration, flip-chip assembly) is a plus.
Understanding of thermal management, vibration control, and precision motion systems advantageous.
If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
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[Semiconductor] Mechanical Design Engineer
Singapore Posted about 15 hours ago
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