Job Description

Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence.
Key Responsibilities:
Provide leadership and strategic direction for the bumping engineering team
Oversee development, optimization, and qualification of 300mm bumping processes
Execute technology roadmap and stay ahead of industry trends
Collaborate with manufacturing, quality, equipment engineering, and R&D teams
Manage personnel, equipment, and budget to meet departmental goals
Foster innovation and continuous process improvement
Identify and mitigate process risks to ensure production quality
Ideal Requirements:
Bachelor's in Engineering, Physics, Materials Science, or related field
10-12+ years experience in bumping engineering or 300mm wafer processing
If you would like to be considered for this opportunity, please forward a copy of your full CV to melissa.lin@ambition.com.sg
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer SGD1,000 or SGD350 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.
Sign up for job alerts
If you are a human, ignore this field Create alert
You agree to our
Share this job
[Semiconductor Packaging] Bumping Process Manager
Singapore Posted 2 days ago
Quick Links
Connect
We are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.