Job Description

Your responsibilities will include, but are not limited to, the following: Improve current process flows and develop innovative solutions to meet product requirements and manufacturability. Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability. Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners. Establish proof of concept for future tech nodes at the manufacturing facility. Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing. Passionate about semiconductor technology and innovation. Adept at data analysis, problem-solving, and process integration optimization. Excellent communication skills and ability to work in cross-functional teams. PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field 2 years of experience in the semiconductor industry is an advantage. Proficiency in data analysis, visualization or simulation software, such as JMP, Tableau is desirable. Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms. In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable. Experience in semiconductor R&D product life cycle from design to manufacturing is desirable. Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment. Innovation, Tenacity, Collaboration and Customer Focus

Skills Required