Job Description

Lead and manage equipment-related activities in HBM production lines, including installation, qualification, troubleshooting, and maintenance. Drive continuous improvements in equipment performance, uptime, and process capability to meet production targets Work closely with cross-functional teams (process, integration, R&D, planning) to support new product introductions and process changes related to HBM. Establish and optimize equipment parameters and procedures for HBM manufacturing, ensuring compliance with quality and safety standards. Lead root cause analysis and corrective actions on equipment-related issues. Evaluate and recommend new tools, technologies, and upgrades to enhance HBM equipment capabilities. Train and mentor junior engineers and technicians on best practices and standard operating procedures. Generate and maintain accurate equipment documentation and preventive maintenance plans. Participate in capacity planning and equipment layout for HBM expansion projects. Higher Diploma with more than 15 years of relevant semiconductor experience or Bachelors with more than 10 years of relevant semiconductor experience. Minimum of 5 years of hands-on semiconductor equipment engineering experience, preferably on semiconductor packaging process including assembly, bumping and / or RDL process, including hands-on experience working on HBM related technologies. Strong understanding of HBM-related equipment, preferably in the area of thermo-compressive bonding, wafer clean, grind and trim, wafer molding, wafer mount, TnR. Worked on process/equipment development with fundamental understanding to execute to improve maturity for HBM related equipment Problem-solving mindset with a drive for finding effective solutions. Understanding on statistical process control and process development with structured DOE.

Skills Required