Job Description

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The Opportunity:
Adecco has partnered with a leading global OSAT company to recruit a Senior Manager for the Wafer Bumping Department.
This is an exciting leadership opportunity for a seasoned professional to take charge of a critical manufacturing function within a high-tech, fast-paced environment.
The successful candidate will be responsible for overseeing and optimizing wafer bumping processes, implementing continuous improvements, and leading a team of skilled process engineers.
We are looking for a technically strong individual with deep expertise in wafer bumping and a proven ability to manage and develop engineering talent.
The Job:

• Lead and mentor engineers within the Bump Process Department to enhance technical capabilities and foster continuous professional growth.
• Develop and implement training programs to enhance engineers' technical and soft skills
• Cultivate a culture of teamwork, open communication, and trust, where team members work collaboratively to solve problems and achieve shared goals
• Drive smooth project execution while addressing technical challenges and ensuring customer requirements are met.
• Collaborate with other departments such as R&D, Production, Quality, and Supply Chain to ensure seamless integration of new processes and technologies into the manufacturing workflow
• Provide technical expertise and guidance during the development and scaling of new products and processes.
• Actively contribute to proposal development and technical discussions during business negotiations.
• Build and maintain strong relationships with internal and external stakeholders, including customers and suppliers.
• Evaluate and implement new processes, materials, and technologies, ensuring alignment with customer needs and project requirements.
• Provide regular updates to customers and suppliers on progress, ensuring transparency and driving the adoption of new technologies and innovations.
• Act as a liaison between technical teams and customers to ensure that expectations are clear and met.

The Talent:

• Bachelor's degree in Engineering or related field.
• 5 years of leadership experience in a technical or engineering environment.
• Familiarity with semiconductor manufacturing establishment.
• Experience in Lean Six Sigma methodology.

Next Steps:

• Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
• Apply through this application or send your resume to huiyang.loo@adecco.com in MS Word Copy. We'd love to hear from you!
• We regret that only shortlisted candidates will be notified.

Loo Hui Yang
Direct Line: 9342 5045
EA License No: 91C2918
Personnel Registration Number: R11011456