Job Description

Work closely with cross-functional teams (equipment, integration, R&D, planning) to support new product introductions and process changes related to HBM. Establish and optimize process parameters, recipes, and procedures for HBM manufacturing, ensuring compliance with quality and safety standards. Lead root cause analysis and corrective actions on yield and process/equipment-related issues. Evaluate and recommend new tools, technologies, and upgrades to enhance HBM equipment capabilities. Train and mentor junior engineers and technicians on best practices and standard operating procedures. Generate and maintain accurate process documentation, FMEA and SPC charts. Participate in capacity planning and equipment layout for HBM expansion projects. Bachelor's degree in Electrical & Electronics, Chemical, Mechanical, Materials Engineering or equivalent with more than 9 years of relevant semiconductor experience. Minimum of 5 years of hands-on semiconductor process engineering experience, preferably on semiconductor packaging process including assembly, bumping and / or RDL process, including hands-on experience working on HBM related technologies. Strong understanding of HBM-related processes and technologies, preferably in the area of thermo-compressive bonding, wafer mount, NCF lamination, wafer debond, pre-encap plasma. Experience in process development with fundamental understanding to execute to improve maturity for HBM related process Problem-solving mindset with a drive for finding effective solutions. Understanding on statistical process control and process development with structured DOE.

Skills Required