Job Description

Are you passionate about ensuring the reliability of cutting-edge semiconductor packages? Do you have a knack for problem-solving and a drive to innovate? We're looking for a talented Package Reliability Engineer to join our team and help us push the boundaries of what's possible. As a Package Reliability Engineer, you'll play a critical role in developing and implementing reliability methodologies, identifying and mitigating failure mechanisms, and collaborating with cross-functional teams to drive innovation. If you're up for the challenge and have a strong background in materials science, physics, or electrical engineering, we want to hear from you!

In your new role you will:

• Establish new reliability methodologies focusing on humidity stress testing capabilities for feasibility studies and early reliability assessment in package development.
• Define stress concepts for assessment of humidity and bias-related failure mechanisms, e.g. using test structures and trigger implementation in laboratories.
• Identify new failure modes and mechanisms, develop new methods (e.g. accelerated tests) and define lifetime model or reliability models which are not covered by standards to support Technology to Market (T2M).
• Define reliability assessment plan for new package technologies based on package requirement profiles and Failure Mode and Effects Analysis (FMEA) with failure mechanism-based approach, thereby qualifying the technical capability of a package technology to meet the specified reliability requirements (including customer mission profile).
• Execute reliability stress tests in packages, technology platform with electrical and physical analyses through system applications or referencing of existing reliability data, to assess reliability result, derive conclusions and recommendations.
• Drive qualification of new packages / processes and production and changes for both in-house and external assembly houses, including China subcontractors.

Your Profile
You are best equipped for this task if you have:

• Bachelor or Master Degree in Materials Science, Physics, Chemical, or Electrical & Electronics Engineering
• Minimum 3 to 5 years of experience in Frontend or Backend Semiconductor Manufacturing Industry
• Basic knowledge in Package Reliability and Qualification
• Ideally, specific knowledge in Humidity-related Failure Mechanisms
• Ability to work independently, pro-actively, and drive values through innovation (e.g., bring ideas to full implementation)
• Strong team player with good communication and interpersonal skills
• Familiarity with Problem-Solving Techniques, Statistical Analysis, and Failure Mode and Effects Analysis (FMEA) Methodology

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
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