Adecco is partnering with a Chip Design Start-up invested by an international consortium and founded by a senior chip design technical team. The company is headquartered in Singapore and will take root in Singapore for long-term development.We are currently searching for a Senior/ Staff Packaging Engineer to join their organization as one of the pioneer team member.The Job:
Responsible for packaging solutions and design, defining performance criteria for signal integrity (SI), power integrity (PI), and thermal performance.
Optimize power performance in packaging design, focusing on PI and SI parameters.
Manage collaboration and technical communication with packaging and testing vendors.
The Talent:
Bachelor's degree or higher in Electronic Engineering, Microelectronics, Computer Science, or a related field.
Minimum of 5 years of experience in packaging design and development, or experience in project development at a design company.
Strong communication and coordination skills, teamwork spirit, and resilience under pressure.
Next Steps:
Prepare your updated resume (please include your current salary package with a full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
Apply through this application or send your resume to huiyang.loo@adecco.com in MS Word Copy. We'd love to hear from you!
We regret that only shortlisted candidates will be notified.
Loo Hui Yang Direct Line: 9342 5045 EA License No: 91C2918 Personnel Registration Number: R11011456