In your new role you will: * To support the package development and qualification projects by carrying out various physical / chemical analysis activities, such as laser decapsulation, chemical decapsulation, plasma decapsulation, In your new role you will: To support the package development and qualification projects by carrying out various physical / chemical analysis activities , such as laser decapsulation , chemical decapsulation , plasma decapsulation , Scanning Electron Microscope , wire bond strength testing & characterization tasks Being second owner for related Failure Analysis (FA) equipment and be responsible for equipment maintenance for minimum downtime. Participate in lab improvement projects, such as green lab project. Your ProfileYou are best equipped for this task if you have: Diploma in Chemistry, Materials, Electrical or Mechanical Engineering. Experience in Integrated Circuit manufacturing process and development Strong working knowledge in Microsoft Office. Experience in Failure Analysis techniques and tools , such as chemical decapsulation and delayering , Scanning Electron Microscopy, plasma decapsulation, wire bond strength testing Benefits What we offer you in Singapore Singapore is our regional headquarter for Asia-Pacific and consists of production, research & development, sales & marketing, supply chain and many central functions.
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