Senior/process Engineer (wet & Dry Bumping)
Singapore, Singapore
Job Description
Responsibilities:
- Responsible for Line sustaining activities and new device process development/evaluation.
- Support NPI for any gap analysis and new device safe launch monitoring.
- Recipe creation based on device requirements.
- Perform process window study and provide improvement plan to reduce OOC and improve CPK.
- Lead continuous improvement projects and device qualifications using APQP approach.
- Work with QM (Quality Management) department to address customer inquiries and issues.
- Execute CIP (Continuous Improvement Program) or manage projects that contribute to improved yield & cost efficiency.
- Characterizing process and ensure SPC is well maintained and under control.
- Start up and qualify new processes/material and new equipment within the scheduled timeline.
- Work with RnD for new technology roadmap and report the evaluation results in a timely manner.
- Update specifications/documentation to meet TS16949 Quality Standard requirements. (Work instruction, pFMEA, OCAP)
- Involvement in Smart Factory (Scope inspection, AI ADC for AOI, Hand Free automation).
Requirements:
- Bachelors\xe2\x80\x99 degree in Engineering with minimum 2-3 years of experience in the semiconductor manufacturing industry with exposure to dry process such as photolithography/plasma, sputtering; or wet process such as electrochemical plating, wet etching etc.
*Interested candidates, please apply by sending your resume in MS Word format. By submitting your application, you agree that your personal data will be collected for recruiting purposes. We regret that only shortlisted applicants will be notified. Registration No. R1333447 EA Licence No. 18C9464
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Job Detail
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Job IdJD1252609
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationSingapore, Singapore
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EducationNot mentioned