Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of mainstream semiconductor Processes and Advanced Packaging processes.
Highly desirable for a candidate to have a background in at least one of the following areas: Photolithography, PVD and CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology (some areas may be combined).
Collaborate with process engineering to identify and implement root-cause corrective actions for equipment failures, ensuring permanent solutions and minimizing chronic and long-term downtime.
Lead continuous improvement teams to drive improvements in tool matching, availability, and throughput, and reduce risk.
Management of new tool installation, start-up, and tool upgrades to increase fab capability and capacity, lower costs, and improve yields.
Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
Participate in cross-functional teams that create efficiencies across all layers of the organization.
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