Job Description

:Our vision is to transform how the world uses information to enrich life for all.Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. JR65914 SMTS/DMTS in Package DesignIn this role, you will be a technical leader in Micron\xe2\x80\x99s Package Development Engineering group driving chip package interaction test vehicle concepts, generating process and reliability test plans supporting. You will collaborate with Micron\xe2\x80\x99s world-wide engineering talent that includes front end BEOL CPI, Si design, package design, substrate technology, package technology development, characterization, thermomechanical simulation, product engineering, design & development quality.Responsibilities will include, but are not limited to:

• Logic, DRAM, and Graphic flip chip package interaction (CPI) design rule owner covering relevant Fab BEOL, Substrate, and Assembly rules.
• Provide technical direction for test vehicle development DRAM and GDDR flip chip memory products.
• Collaborate with package design, package technology development, Fab BEOL technology development, product engineering, and global quality to identify potential failure mechanisms, provide CPI risk assessments and risk mitigation solutions.
• Provide EFA and PFA support as needed to debug CPI related failures, identify root cause.
• Recommend optimum design criteria to meet product electrical, mechanical, and thermal quality and reliability performance requirements.

Required Qualifications:

• Bachelor/ Masters in Materials, Mechanical, Chemical, or Electrical Engineering.
• 15+ years of relevant industry experience in semiconductor/packaging
• Experience with chip package interactions and 1st level chip interconnect reliability
• Experience with materials & BOM selection, Fab BEOL, and package assembly
• Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.

Preferred Qualifications:

• Strong publication record,
• An established network with peers in the industry and relationships with key stakeholders.

Keen on the role? Apply with us!About Micron Technology, Inc.We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron\xc2\xae and Crucial\xc2\xae brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities \xe2\x80\x94 from the data center to the intelligent edge and across the client and mobile user experience.To learn more, please visit micron.com/careersAll qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.To request assistance with the application process and/or for reasonable accommodations, please contactMicron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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