Job Description

Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction (EFMEA), maturity (EMI), and adoption for current and next node of 3D NAND technology. Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment. Work with process development team to quantify benefits of equipment/CIP hardware. Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts. Participate with equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements. Identify disruptive equipment early, work with manufacturing and to identify viable evaluation path forward in manufacturing. Design and implement advanced equipment monitoring and control methodologies. Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity. Lead and initiate innovation projects through patents/technical papers. Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods. PHD or Master of Science in Mechanical Engineering or >2 years of experience in the semiconductor industry in the area of equipment engineer roles. In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must. Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred. Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers' and/or management help to get over the roadblocks to drive to solutions. Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.