Job Description

Key Job Responsibilities:

Develop and optimize TBDB processes for various wafer-level packaging applications Select appropriate materials (e.g., adhesives, carriers) and stabilize related process conditions Design integrated process flows including wafer thinning, bonding, and debonding Analyze compatibility with downstream processes and perform process tuning accordingly Investigate and resolve defect issues such as voids, warpage, and delamination Coordinate TBDB equipment installation and optimize process parameters Propose customized process solutions based on customer product and reliability requirements

Qualifications:

Bachelor's degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials Minimum 3 years of hands-on experience in TBDB process development Understanding of material properties for adhesives, carriers, and thermal interface materials Knowledge of bonding techniques under high temperature and pressure, including heat transfer, stress, and interfacial behavior Familiarity with semiconductor back-end or advanced packaging process flows Strong skills in experiment design, data analysis, and process documentation Excellent problem-solving and root cause analysis capabilities in process-related issues Experience in advanced packaging technologies such as 2.5D/3D, TSV, CoWoS, and fan-out Hands-on experience with TBDB equipment operation Knowledge of adhesive and laser debonding techniques Proven experience in cross-process integration and process optimization Understanding of reliability evaluation and qualification standards * Proficiency in technical writing and communication with global customers in English