PYXIS CF PTE. LTD.
About PYXIS CF PYXIS CF Pte Ltd is a Singapore based developer of next generation Thermo Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support…
Position Summary: The Electrical Engineer will design and integrate high precision control electronics for motion, force, and thermal subsystems within the Thermocompression Bonder. The role requires deep experience in sensor signal conditioning, low noise circuit design, and real time feedback…
Position Summary: We are seeking a highly skilled Mechatronics Engineer to join our Thermocompression Bonder (TCB) development team. The ideal candidate will possess strong experience in precision motion control systems, force sensing and feedback, and thermal mechanical alignment technologies. This…
Position Summary: The Software Engineer will be responsible for developing precision motion and process control software for next generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real time control, sensor feedback loops, and multi…
1. Job Description Design and develop PC based automated visual inspection systems for our full range of semiconductor equipment. Evaluate and feasibility study on the customer’s vision specifications. Responsible to integrate any new vision hardware (camera, frame grabber, etc) onto…
Candidate must possess at least Diploma in Electrical/Electronics/Automation Control Engineering or equivalent. At least 3 Year(s) of working experience in the related field is required for this position. Knowledge of C#, .net WPF is a must. Knowledge of PLC is…