Job Description

Adecco is partnering with a global leader back end semiconductor equipment manufacturer. The company\'s product portfolio comprises dicing, cutting saws, polishers, laser saws, grinders, wafer mounters, die separators, surface planers, and waterjet saws.Responsibilities:

• Laser Process development support for customer
• Perform in house application test cut and on site customer support
• Process development support to customer
• Process customer claim for abrasive product
• Good knowledge on blade / wheel / Laser technical support
• Required technical understanding
• Participate in company organized activities
• Promote good interdepartmental relationship
• Establish and maintaining good relationship with customers
• Communicate frequently with Engineer from Japan

Requirements:

• Dicer / Grinder/ Laser knowledge / experience is preferred
• Diploma in Mechanical, Electronic or any other engineering disciplines
• 1 - 2 years relevant working experience preferably in semiconductor industry
• Proficient in MS office - Powerpoint / Excel
• Willing to travel and might need to work late
• Pro-active, people & team-oriented

Benefits:

• Dental and medical benefit upon commencement
• Specialist benefit (after confirmation)
• Yearly health screening package + 1.5 days leave (after confirmation)
• 14 days annual leave (starting)
• 3 contractual bonuses (fixed bonus, spring bonus and AWS)
• Other non-contractual bonus

(Usually total around 5-8 months bonus a year) * Company trip yearly (Japan, Dubai, Taiwan, Thailand etc)

• Overtime pays
• Company phone
• $132 commuting allowance monthly

Next Step

• Interested applicants, please send your resume to amytrang.nguyen@adecco.com with your current and expected salary.
• Only shortlisted candidates will be contacted.

Amy Trang NguyenDirect Line: +65 6697 7960
EA License No: 91C2918
Personnel Registration Number: R22104357

Adecco