Engineer Wafer Bumping Equipment
Singapore, Singapore
Job Description
Responsible for equipment setup, troubleshooting, and reliability improvement of wafer bumping systems. This role plays a key part in maintaining uptime, supporting smart factory operations, and driving continuous improvement initiatives.
Key Responsibilities:
- Lead equipment support and technical analysis
- Plan and execute preventive/corrective maintenance
- Oversee installation, startup, and reliability enhancement
- Troubleshoot failures and implement upgrades
- Drive equipment performance improvement (OEE, capacity)
- Manage vendor negotiations and parts tracking
- Develop SOPs and quality documentation
- Support AMR, CDS systems, and ESD monitoring
- Train and mentor junior technicians
- Conduct system risk assessments
- Degree in Mechanical, Electrical, or Electronics Engineering
- At least 3 years' experience in semiconductor equipment engineering
- Strong analytical, troubleshooting, and communication skills
- Familiarity with smart factory tools and system-level maintenance
Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.
Business Registration Number : 200611680D | Licence Number : 10C5117 | EA Registration Number: R25127614
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Engineer - Wafer Bumping Equipment
Singapore Posted about 14 hours ago
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Job Detail
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Job IdJD1586172
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationSingapore, Singapore
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EducationNot mentioned