OverviewWe are seeking a talented and motivated Hardware Architect (AI Sub-system) to join our R&D team to own, define, and drive exploration and design of the next generation hardware for AI sub-system in high performance computing (HPC) SoCs.Our division\'s mission is to use the latest AI and cloud technologies to develop the best AI inference for advanced driver safety engineers building self-driving vehicles and other high performance compute products. Renesas is the leading automotive electronics supplier globally, and this is a rare opportunity to develop the infrastructure required to deploy our AI software to the billions of devices we ship to customers every year. You will join our newly formed AI & Cloud Engineering organization of around 100 software engineers. Due to strong demand for our AI-related products we are planning to triple in size in the next three years, so there is lots of room for you to help us grow the team together while remaining small. We are focusing on our hiring into our Tokyo, Beijing and Singapore sites. If you are successful and living outside of these cities, we can support your relocation to one of the three sites based on team needs.Responsibilities * Participate and lead in the architecture design of next generation multi-core AI sub-system including CPU/DSP/NPU, memory hierarchies, scalable interconnects, etc.
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