Laser Groove Process Engineer (semicon Industry)
Job Description
Responsibilities: Responsible for Laser Grooving/Wafer Saw process qualification, implementation, procedure generation and control Perform analysis on process related issues and provide solutions for improvement Provide disposition on-hold lots and raw materials in production line Generate and maintain procedures and specifications for production reference and simplification Execute Continuous Improvement Project or activities in Quality, Delivery and Cost Coordinate and communicate with customers for the process related issues and activitiesRequirements: Degree in Mechanical/Electrical Engineering with minimum 2 years exposure to production operations in Laser Grooving and Wafer Dicing Knowledge of quality control tools like SPC, MSA, DOE, FMEA, CP etc*Interested candidates, please apply by sending your resume in MS Word format. By submitting your application, you agree that your personal data will be collected for recruiting purposes. We regret that only shortlisted applicants will be notified.Registration No. R1333447EA Licence No. 18C9464Job Types: Full-time, PermanentSalary: $3,500.00 - $5,000.00 per monthBenefits:
- Health insurance
- Professional development
- Monday to Friday
- 13th month salary
- Performance bonus
- Laser Grooving and Wafer Dicing: 2 years (Preferred)
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Job Detail
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Job IdJD1124866
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IndustryNot mentioned
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Total Positions1
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Job Type:Full Time
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Salary:Not mentioned
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Employment StatusPermanent
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Job LocationSingapore, Singapore
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EducationNot mentioned