Job Description

Responsibilities:

• Provide guidance for a team of process engineers in setup, qualification and production ramp up activities

• Responsible for setting up critical bumping recipe at PVD and Lithography process

• In-charge of lot dispositions and OCAP (Out-of-control Action Plan) executions for any deviating material

• Lead continuous improvement projects and device qualifications using APQP approach

• Working with QM (Quality Management Department on customer inquiries and issues responses

• Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement

• Ensure SPC (Statistical process Control) is maintain and in control

• Lead on new material evaluation and new process parameter setup

• Set up new devices and process according to customers’ requirements

• Perform process development activities, line optimisation and cost control particularly at Dry processes (i.e., Photolithography)
  

• Degree in Electronics/Mechatronics/Material Science or related semiconductor manufacturing disciplines with minimum 5-year experience in Wafer Dry process running high volume

• Knowledge in: Statistical Process Control (SPC), Out of Control Action Plan (OCAP) and JMP

• Strong background in wafer dry process knowledge such as: Sputtering, Descum, Coating, Exposure, Developing, curing process is an advantage

• Sputtering/thin film deposition or Photolithography process development and hands-on set up experience is preferred

• Subject matter expertise in Photolithography or Thin film deposition/Sputtering is an advantage

• Familiar in FMEA, 8D and DOE execution approach is an advantage

• Knowledgeable in process development/qualification and audits activities of process and new devices

• Willing to work in high volume and dynamic semiconductor cleanroom environment