$5K + AWS + VB + allowance5 working days, Mon - Fri, normal office hoursLocation: CentralResponsibilities
Design and develop modules for high-speed Flip Chip Bonder.
To be able to design and develop Bond heads and/or Wafer Modules with high-speed ejection system and/or High-Speed Pick and Place modules.
Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
Planning, Scheduling and Costing of Machines and Mechanical Modules
Working closely with Electrical, Vision and Software Engineers.
Work extended hours in critical phases of project execution.
Travel for Machine Installations and Buy Off
Any other ad-hoc duties assigned
Requirements
Diploma or Degree in Mechanical Engineering or related technical disciplines.
Minimum 3 years of relevant experience.
Proficiency with Creo is a plus.
Excellent communication and interpersonal skills
Competitive remuneration package will be offered to the shortlisted candidate.Interested candidates, please send your updated CV in MS Words format stating your last drawn salary, expected salary, notice period and reason for leaving last / past employment(s) and email to recruit@caed.com.sg for priority processing.To find out more job opportunities, visit Career Edge Asia at www.caed.com.sg for all job listings.Please connect us via LinkedIn as follows for efficient messaging:Do Join us at TELEGRAM by searching \xe2\x80\x9cCAREER EDGE JOB OPPORTUNITIES\xe2\x80\x9d to receive fast job alert!Attn: Jace Tay (Registration No.: R1331152)CAREER EDGE ASIA PTE LTD EA Licence Number: 13C6678 To find out more job opportunities, visit Career Edge Asia at www.caed.com.sg for all job listings. Email: recruit@caed.com.sgSocial Share:More Information