Job Description

- To be part of New product introduction to deliver them to the market and propose concepts of die attach/wire bonding.

- To liaise with internal/external parties on various projects and standards.

Client Details

A leading technology company providing component-based solutions. A proven market lead in the design and manufacturing of Micro-controllers. Supplying various markets of the world\'s technology pioneers.

Description

- To participate in new product introduction to the market.

- To bring in expert knowledge of concepts of die attach and wire bonding.

- To pilot problem solving projects for internal/external quality issues.

- Be part of the standardisation of substrate/packaging processes.

- To work closely with various departments for optimising processes.

Profile

- Bachelor\'s Degree in Mechanical/Electronics/Packaging or similar working experience.

- At least 7 years of experience in IC/Smart-card packaging.

- Experience in Die attach/Wire bonding technologies/processes.

- Experience of lean manufacturing tools and people management tools

- Good communication for internal/external processes.

Job Offer

Be part of a market leader with a proven track record of delivering its services to exceptional standards of quality, reliability and cost-effectiveness. Empowering people to make a difference and encourages team-building to help employees achieve their full potential.

To apply online please click the \'Apply\' button below. For a confidential discussion about this role please contact Timothy Huang at +65 6416 9863.

Michael Page