Process Engineer (wire Bond//encapsulation/changi)

Singapore, Singapore

Job Description

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Location : East
Working Days: 5 Days, Monday to Friday
Working Hours: 8.30am - 5.30pm
Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Location : East
Working Days: 5 Days, Monday to Friday
Working Hours: 8.30am - 5.30pm
Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Our Client is a leading technology company providing component-based solutions for security and identification. We are a world-class specialist in the design and manufacture of Micro connectors for smartcards and RFID Antennas and Inlays.

Job Responsibilities:
Participate in product introduction to deliver new products to market

Propose new concept of advanced die attach and wire bonding

Bring an extensive expertise in chip packaging to improve our end users application knowledge

Lead the setup of die attach and wire bonding recipes in NPI and new product and profile optimization during mass production

Pilots problem solving projects linked die attach and wire bonding processes, as well as internal and external quality issues

Understand current standards in substrate and packaging processes and propose optimization of design for manufacturability, focusing in die attach and wire bonding operation

Work closely with Engineering to optimize packaging supply base for cost, lead time, quality, standardization

Identify and implement cost saving initiatives related to packaging materials, labour efficiency, integration of process, handling, etc

Requirements:
Bachelor Degree/Diploma in Mechanical / Electronics/ Electronics Packaging or equivalent

3-5 years of experience in IC or smartcard packaging. Strong knowledge and understanding in die attach, wire bond technologies in IC packaging industries

Competent in the assembly processes of die attach and wire bonding of a smartcard module, knowledge with ASM equipment will be an added advantage

Ability to troubleshoot failure of die attach and wire bond machines

Next Step

Interested applicants kindly send in your detailed WORD format CV to Jasmine.Toh@adecco.com

Only shortlisted candidates will be notified

Jasmine Toh Law Ting

Direct Line: +65 9273 6741
EA License No: 91C2918
Personnel Registration Number: R2092390

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Job Detail

  • Job Id
    JD1290887
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Singapore, Singapore
  • Education
    Not mentioned