Process Engineer (wire Bond//encapsulation/changi)

Singapore, Singapore

Job Description


Location : East Working Days: 5 Days, Monday to Friday Working Hours: 8.30am - 5.30pm Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Location : East
Working Days: 5 Days, Monday to Friday
Working Hours: 8.30am - 5.30pm
Salary Package: Starting salary per month depending on experience, AWS with VB, and Permanent Benefits

Our Client is a leading technology company providing component-based solutions for security and identification. We are a world-class specialist in the design and manufacture of Micro connectors for smartcards and RFID Antennas and Inlays.

Job Responsibilities:

  • Participate in product introduction to deliver new products to market
  • Propose new concept of advanced die attach and wire bonding
  • Bring an extensive expertise in chip packaging to improve our end users application knowledge
  • Lead the setup of die attach and wire bonding recipes in NPI and new product and profile optimization during mass production
  • Pilots problem solving projects linked die attach and wire bonding processes, as well as internal and external quality issues
  • Understand current standards in substrate and packaging processes and propose optimization of design for manufacturability, focusing in die attach and wire bonding operation
  • Work closely with Engineering to optimize packaging supply base for cost, lead time, quality, standardization
  • Identify and implement cost saving initiatives related to packaging materials, labour efficiency, integration of process, handling, etc
Requirements:
  • Bachelor Degree/Diploma in Mechanical / Electronics/ Electronics Packaging or equivalent
  • 3-5 years of experience in IC or smartcard packaging. Strong knowledge and understanding in die attach, wire bond technologies in IC packaging industries
  • Competent in the assembly processes of die attach and wire bonding of a smartcard module, knowledge with ASM equipment will be an added advantage
  • Ability to troubleshoot failure of die attach and wire bond machines
Next Step
  • Interested applicants kindly send in your detailed WORD format CV to
  • Only shortlisted candidates will be notified
Jasmine Toh Law Ting

Direct Line: +65 9273 6741
EA License No: 91C2918
Personnel Registration Number: R2092390

Adecco

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Job Detail

  • Job Id
    JD1297699
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    $54000 - 84000 per year
  • Employment Status
    Permanent
  • Job Location
    Singapore, Singapore
  • Education
    Not mentioned