Job Description

R&D Director

We are seeking an experienced R&D Director to lead the Advanced Packaging research and development team. This role is responsible for driving innovation, developing new packaging technologies, and ensuring the successful commercialization of advanced packaging solutions. The ideal candidate will possess deep technical expertise, strong leadership skills, and a proven track record in semiconductor packaging and assembly.


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Responsibilities

Define and execute the R&D strategy for Advanced Packaging solutions, aligning with business objectives and market trends. Lead the end-to-end development of advanced packaging technologies (e.g., Fan-Out, 2.5D/3D integration, Heterogeneous Integration, Flip-Chip, and Wafer-Level Packaging). Oversee the entire product development lifecycle, from concept to prototyping, validation, and commercialization. Collaborate with cross-functional teams, including Product Management, Engineering, and Manufacturing, to ensure smooth technology transfer. Innovation & ResearchDrive cutting-edge research to develop novel materials, processes, and equipment for advanced packaging. Partner with universities, research institutes, and industry consortia to stay at the forefront of technology advancements. Evaluate emerging trends such as chiplet architectures, hybrid bonding, and AI-driven packaging solutions. Build, mentor, and lead a high-performing R&D team of engineers and developers Foster a culture of innovation, collaboration, and continuous learning. Engage with key customers to understand requirements and translate them into innovative solutions. Establish partnerships with semiconductor manufacturers, OSATs, and ecosystem players to drive technology adoption. IP & Patent Portfolio ManagementDrive intellectual property (IP) strategy by filing patents and securing ASMPT's leadership in Advanced Packaging technologies.
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Qualifications & Experience

Min. Ph.D. or Master's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field. Minimum 15 years of experience in semiconductor packaging R&D, with at least 5 years in a leadership role. Deep expertise in Advanced Packaging technologies (e.g., Fan-Out, 3D IC, Hybrid Bonding, System-in-Package). Strong knowledge of semiconductor materials, bonding techniques, and reliability testing. Proven track record of bringing new packaging technologies from R&D to mass production. Experience working with global teams and external research partners. * Excellent leadership, communication, and strategic planning skills.